Description

Original Senjum705-GRN360-k2-v Lead-Free high Temperature Sn96.5Ag3Cu0.5 Solder Paste

Very stable solder paste viscosity over a longer period

• Lead-free
• Removal of tip oxidation
• No-clean compatible formula
• Minimal residue
• No need to clean

Sepcifications:

Alloy Composition: Sn 96.5: Ag3.0:Cu 0.5
Melting temperature: 217 – 219C
Powder Size: 25 36um
Flux Type: ROL0
SIR (40C 90% RH): Over 1.0 x 1012
Electro-migration Resistance: Over 1.0 x 109 No Migration
Solder paste Viscosity: K1 180 20 Pa.s; K2 200 20 Pa.s
Thixotropic Index: 0.6
Flux Content: 11.5%
Hot Slump: 0.4mm
Tackiness: 1.3N

Net Weight: 0.5kg